On October 28th, the 2025 NEPCON ASIA, the Asia Electronics Manufacturing Equipment and Microelectronics Industry Exhibition, grandly opened at the Shenzhen World Exhibition & Convention Center. As a trendsetter in intelligent manufacturing, this year's exhibition brought together over 600 leading global electronic manufacturing technology suppliers, covering the entire industry chain from surface mount technology (SMT) to semiconductor packaging and testing, and automation equipment, attracting over 60,000 professional visitors to explore cutting-edge technologies. Among them, Shenzhen ETON Automation Equipment Co., Ltd., under the theme "Intelligent Chain Future, Chinese Precision," made a strong debut with its Glory series pick-and-place machines and innovative SMT complete line solutions, showcasing the groundbreaking achievements of domestically produced high-end equipment to the world.

I.Exhibition Highlights: A Technological Feast for Asian Electronics Manufacturing

NEPCON ASIA 2025, themed "Cross-border Integration, Intelligent Manufacturing for the Future," boasted an 80,000-square-meter exhibition area, concurrently featuring eight other themed exhibitions covering semiconductor packaging and testing, automotive electronics, and the low-altitude economy, forming a 140,000-square-meter industrial ecosystem display platform. From the AI ​​smart glasses disassembly area to the IGBT & SiC module packaging and testing process demonstration line, from flexible manufacturing to embodied robots, the exhibition focused on innovative applications across the entire electronics manufacturing process, providing the industry with forward-looking insights.

In the SMT placement technology exhibition area, E-Tong placement machines, with their independently developed Glory series products, became the focus of the entire event. Their dynamic demonstrations of precise production line coordination, energy consumption control capabilities, and intelligent management systems perfectly aligned with the exhibition's "Green Intelligent Manufacturing" theme, attracting numerous domestic and international visitors to stop and exchange ideas.

II.ETONHonorSeries: Technical Parameters and Performance Breakthroughs

1. YT20S-I Dual-Rail Dual-Arm Pick and Place Machine: High-Efficiency Small-Component Placement Expert

Dual-Rail Dual-Arm Design: Supports simultaneous operation of 104 nozzles on both sides, compatible with mixed use of 8mm and 12mm feeders, achieving a placement speed of 98,000 CPH, accurately covering the high-density placement needs of small tape and reel components.

Precision Control: Employs a quantum vision positioning system and multi-dimensional dynamic compensation algorithm to lock placement accuracy within ±0.02mm, while significantly reducing vibration interference through micron-level magnetic levitation motor drive.

Energy Efficiency Innovation: Single-phase 220V power supply design, power consumption is only 1kW·h per hour, reducing energy consumption by 40% compared to traditional equipment, providing a benchmark solution for sustainable production.

2. YT10S Flexible Placement Machine: A Powerful Tool for Irregularly Shaped Components and ICs

Modular Expansion: The single-rail, single-arm basic architecture supports optional IC backpacks, enabling automatic switching of 15 trays and flexibly handling large-size components, irregularly shaped parts, and chip modules.

Collaborative Capacity: Combined with the YT20S-I to form a dual-mode + single-mode production line, the overall capacity can reach 146,000 CPH in complex product scenarios, balancing accuracy and throughput.

Intelligent Deviation Correction: An independent R-axis control system equips each nozzle with a vacuum sensor, monitoring placement pressure in real time and significantly improving the CPK process capability index.

III. Core Technologies: The "Hardcore Strength" of Domestically Produced Pick and Place Machines ETON's technological moat is built on full-chain self-sufficiency:

Motion Control: The X, Y, and Z axes employ a gantry dual-drive structure and optical encoder positioning, combined with thermal compensation and speed compensation algorithms to solve the precision drift problem during high-speed operation.

Vertical Integration: The 52,000㎡ intelligent manufacturing base in Jiangxi achieves a 99% self-sufficiency rate from precision parts processing to vision algorithms and motion control software, breaking through overseas technological barriers.

Ecosystem Collaboration: Built-in MES intelligent management system and AI quality control cloud platform enable real-time analysis of production data and prediction of equipment maintenance nodes, forming a three-layer closed loop of "equipment-system-data".

IV.Application Scenarios: From Consumer Electronics to Strategic Emerging Industries

Currently, ETON Equipment has penetrated high-end fields such as military, aerospace, semiconductors, new energy, and automotive electronics. For example:

Automotive-grade chips: In SiC power module mounting, silver sintering technology and multi-dimensional compensation technology meet the reliability requirements of high-temperature and high-pressure environments.

Mini LED: Overcoming the challenges of micro-pitch component mounting, supporting mass production of substrates with 0.2mm pin pitch.

Global Cooperation: Products are exported to over 50 countries, serving leading companies such as BYD and Aero Engine Corporation of China, becoming an important representative of "Made in China" going global.

V.Industry Trends: The Future Path of SMT Technology

The three major directions revealed at this exhibition highly align with ETON's strategic layout:

Flexible Manufacturing: The demand for small-batch, multi-variety production drives equipment modularization, with the IC backpack expansion capability of the YT10S being a typical example.

Green Intelligent Manufacturing: Low-energy design responds to the "dual-carbon" strategy; ETON's single-phase power supply solution reduces carbon emissions by 30% compared to three-phase equipment.

AI Empowerment: Shanghai's "AI + Manufacturing" roadmap emphasizes the integration of industrial models and machine vision; ETON's quantum vision system has achieved 3D solder joint inspection and process self-optimization.

VI.Conclusion: The Global Impact of Chinese Precision

On the stage of NEPCON ASIA 2025, Eton's chip-and-place machines, with their triple advantages of precision, efficiency, and independent innovation, demonstrated the global competitiveness of domestically produced high-end equipment. As Eton Chairman Yu Yaoguo stated, "From catching up to leading, 'Made in China' requires continuous technological accumulation and open ecosystem collaboration." With the accelerated digital transformation of the manufacturing industry, Eton is driving development with a dual approach of "technology + scenarios," working with global partners to build an unlimited future for intelligent manufacturing.

Exhibition Preview: Eton will showcase its new semiconductor packaging chip-and-place machine at the Suzhou Electronics Production Equipment Exhibition in November 2025, further expanding the boundaries of wafer-level placement technology.

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