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Solder Paste Inspection (SPI) Machine: 2D vs 3D, and What to Check Before You Buy

Solder Paste Inspection (SPI) Machine: 2D vs 3D, and What to Check Before You Buy

A hands-on SPI machine guide for SMT printing—what SPI measures, 2D vs 3D SPI differences, key specs that matter, and how SPI reduces paste-related defects.

23

2026

/

01

ICT Test in PCB Assembly: What It Is, Costs, and When It Makes Sense

ICT Test in PCB Assembly: What It Is, Costs, and When It Makes Sense

Learn what ICT test is, how in-circuit testing works, fixtures vs flying probe, when to choose ICT, and how it fits into an SMT production line.

23

2026

/

01

Pick and Place Machine Maintenance and Care Precautions

Pick and Place Machine Maintenance and Care Precautions

On an SMT production line, the pick and place machine typically handles the highest load, longest operating time, and highest precision requirements. It is not only the core of production line efficiency but also a key piece of equipment determining the stability of placement quality.

15

2026

/

01

Comprehensive Analysis of Reflow Soldering Temperature Profiles

Comprehensive Analysis of Reflow Soldering Temperature Profiles

From Basic Principles to Practical Applications: In-depth Understanding of the "Soul Parameter" of SMT Soldering

13

2026

/

01

A Complete Guide to Pick-and-Place Machine Nozzles: The "Key Hand" Behind Tiny Components

A Complete Guide to Pick-and-Place Machine Nozzles: The "Key Hand" Behind Tiny Components

In the high-speed, precise placement process of a pick-and-place machine, the nozzle is the only component that directly contacts the component. It is the final executor of precision movements, and its performance directly determines production efficiency

07

2026

/

01

In-depth Analysis of Pick and Place Machine Precision: The Battle of the Micrometers

In-depth Analysis of Pick and Place Machine Precision: The Battle of the Micrometers

In the world of pick and place machines, "precision" is the most dazzling jewel in the crown. It directly determines whether the equipment can handle the most advanced electronic components and is the core benchmark for classifying pick and place machine

05

2026

/

01

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