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Mounter jargon

Number of visits: Date:2016-01-11
Beginning with the letter A
Accuracy (precision): Measuring the difference between the results with the target value.
Additive Process (additive process): a method of manufacturing a PCB electrical wiring by selective precipitation of conductive material (copper, tin, etc.) on the board floor.
Adhesion (adhesion): similar to the attraction between molecules.
Aerosol (aerosols): small enough to airborne particles of the liquid or gas.
Angle of attack (AOA): the angle between the surface and the silk screen printing scraper plane.
Anisotropic adhesive (glue anisotropy): A conductive substance, which particles only in the Z-axis direction by the current.
Annular ring (donut): electrically conductive material surrounding a borehole.
Application specific integrated circuit (ASIC Application Specific Integrated Circuit): Customer set made specially for circuit use.
Array (Array): a group of elements, such as: Tin ball point, arranged in a matrix.
Artwork (wiring diagram): PCB conductive wiring diagram for generating the original photograph can be produced in any proportion, but is generally 3: 1 or 4: 1.
Automated test equipment (ATE Automatic Test Equipment): To assess the performance level, designed for automatic analysis device or static parameters, but also for fault isolation.
Automatic optical inspection (AOI automated optical inspection): in the automatic system, using the camera to check the model or object.
Beginning with the letter B
Ball grid array (BGA ball grid array): IC packaging, its input and output point is on the bottom surface of the element arranged in a grid pattern of the solder ball.
Blind via (blind via hole): PCB conductive connection between the outer layer and the inner layer, does not continue through to the other side of the plate.
Bond lift-off (welding lifted off): The welding pins from the pad surface (the circuit board substrate) separate fault.
Bonding agent (adhesive): The formation of a single layer plywood glue bond.
Bridge (bridging): the solder conductive connection of the two conductors should be connected, causing a short circuit.
Buried via (buried vias): PCB conductive connection of two or more between the inner (i.e., invisible from the outer layer).
Beginning with the letter C
CAD / CAM system (computer-aided design and manufacturing systems): computer-aided design is the use of specialized software tools to design printed circuit structure; computer-aided manufacturing put this design into a real product. These systems include data processing and storage for large-scale memory, creative design for input and convert the stored information into graphs and reports output devices
Capillary action (capillary action): the molten solder, against gravity, in a natural phenomenon closely spaced solid surface flows.
Chip on board (COB board chips): a hybrid technology that uses a chip component side up deadlocked, traditionally exclusively connected to the circuit board substrate layer by fly line.
Circuit tester (circuit tester): A test approach in PCB production. Comprising: a needle bed, component pin footprint, guiding the probe, the internal trace, load board, empty plate, and component testing.
Cladding (cover layer): a thin layer of a metal foil layer adhered to the plate PCB conductor tracks.
Coefficient of the thermal expansion (thermal expansion coefficient): when the surface temperature of the material is increased, the measured temperature of each of the expansion of the material in parts per million (ppm)
Cold cleaning (cold cleaning): an organic dissolution process, the liquid contact completion after welding residue removal.
Cold solder joint (cold solder joints): a reflection of the role of insufficient solder wetting point, characterized in that, due to insufficient or improper cleaning heating, looks gray, porous.
Component density (cell density): by dividing the number of components on the PCB board area.
Conductive epoxy (conductive epoxy resin): A polymeric material, by adding metal particles, usually silver, current is passed through.
Conductive ink (conductive ink): glue on a thick film material used to form the conductive wiring pattern PCB.
Conformal coating (conformal coating): A thin protective coating applied to compliant assembly profile PCB.
Copper foil (foil): A female qualitative electrolytic material deposited on a thin base layer on the circuit board, the continuous metal foil, as PCB conductor. It is easily bonded to the insulating layer, receiving a printed protective layer formed after etching circuit pattern.
Copper mirror test (Mirror Test): A flux resistance test on a glass plate using a vacuum deposition film.
Cure (baking curing): changes in the physical properties of the material on through chemical reaction, or pressure / no pressure on the thermal reaction.
Cycle rate (circulation rate): A component placement term, used to measure from handling, positioning plate and return the machine speed, also known as test speed.
Beginning with the letter D
Data recorder (data logger): In certain time intervals, from a thermocouple attached to the PCB measuring, collecting temperature equipment.
Defect (defect): an element or circuit elements deviate from the normal accepted characteristics.
Delamination (layered): Separate separation and plate layer and the conductive layer of the cover layer between the plate.
Desoldering (desoldering): the welding element disassembly to repair or replace, the method comprising: using suction aspiration tin tin with vacuum (solder straw) and hot plug.
Dewetting (dehumidification): the first covering the molten solder, after the recovery process, leaving irregular residue.
DFM (design for the manufacture of sake): the most efficient way to produce products of the method, the time, cost, and available resources into account.
Dispersant (dispersant): a chemical added to the water to increase its ability to particles.
Documentation (documentation): For information on the assembly to explain the basic design concepts, components and materials, the type and quantity of specialized manufacturing instructions and the latest version. The use of three types: a small number of prototype and run, standard production line and / or quantity of production, as well as government contracts that specify the actual graphic.
Downtime (Downtime): equipment maintenance or failure of the product without the production time.
Durometer (hardness): Measurement of rubber or plastic scraper blade hardness.
Beginning with the letter E
Environmental test (environmental testing): one or a series of tests used to determine the external structure, mechanical and functional overall impact of packaging for a given element or assembly integrity.
Eutectic solders (eutectic solder): two or more metal alloy with the lowest melting point, when heated, eutectic alloy change directly from a solid to a liquid, rather than through the plastic stage.
Beginning with the letter F
Fabrication (): After the design before the empty board assembly manufacturing process, a separate process comprises a stack, the metal addition / minus, drilling, plating, wiring and cleaning.
Fiducial (reference point): and a circuit pattern integrally dedicated marker for machine vision to identify the orientation and position of the wiring diagram.
Fillet (fillet): between the pad and component lead the formation of solder connections. Namely joints.
Fine-pitch technology (FPT Fine pitch technology): surface mount device package pin center spacing of 0.025 "(0.635mm) or less.
Fixture (fixtures): Connection to PCB handling machine center.
Flip chip (flip chip): A leadless structure, generally contains circuit unit. Designed for (covered with a conductive adhesive) by an appropriate number of solder balls at its surface, the electrically and mechanically connected to the circuit.
Full liquidus temperature (complete liquefaction temperature): Solder temperature level reaches maximum liquid state, is best suited for good wetting.
Functional test (functional test): simulate the intended operating environment for the entire assembly of electrical testing.
Beginning with the letter G
Golden boy (like gold): a component or circuit assembly, have been tested and meet the technical specifications of known functions, by comparing the test for the other units.
Beginning with the letter H
Halides (halide): comprising fluorine, chlorine, bromine, iodine or astatine compound. The catalyst portion flux, because of its corrosive, must be removed.
Hard water (hard water): water containing calcium and other ions can accumulate inside the clean surface of the device and cause obstruction.
Hardener (hardener): chemicals added to the resin, so that curing in advance, that is a curing agent.
I begin with the letter
In-circuit test (online testing): A one test element to the placement and orientation of test elements.
Beginning with the letter J
Just-in-time (JIT just in time): by directly into pre-production supply materials and components to the production line, in order to minimize the inventory.
Beginning with the letter L
Lead configuration (pinouts): From element extending conductor acts as a mechanical and electrical connection of two points.
Line certification (production line confirmation): confirm the order controlled production line, in accordance with requirements to produce reliable PCB.
Beginning with the letter M
Machine vision (machine vision): One or more cameras, to help find the part center or elements of the system to improve placement accuracy.
Mean time between failure (MTBF Mean Time Between Failures): expected average statistical time possible failure of the operation unit intervals, usually in hourly, results should show the actual, anticipated or calculated.
Beginning with the letter N
Nonwetting (not melt wet): solder does not adhere to a surface of the metal. Since surface contamination to be welded, not wetting is characterized by bare base metal is visible.
Beginning with the letter O
Omegameter (Omega table): An instrument used to measure the amount of PCB surface ionic residues, then, measured and recorded due to the ionic residues caused by the immersion assembly known mixture of alcohol and water of high resistivity, the resistivity decreases.
Open (open): two electrical connection points (pins and pads) becomes separated, insufficient solder reason either, but for a connection point lead coplanarity is poor.
Organic activated (OA organic activity): organic acid as the active agent a fluxing system, water-soluble.
Beginning with the letter P
Packaging density (mounting density): PCB component placement on (active / passive components, connectors, etc.) number; expressed as low, medium or high.
Photoploter (photo plotters): The basic wiring diagram processing equipment for the production of the original PCB layout on photographic film (usually the actual size).
Pick-and-place (pick - mount devices): A programmable machine with a mechanical arm, from the automatic feeder pickup element, moving to a fixed point on the PCB to put stickers in the right direction on the right location .
Placement equipment (mount devices): combine high speed and accurate positioning to the component placement on PCB machines, divided into three types: massive transfer of SMD's, X / Y positioning and online transfer system, can be combined in order to adapt to the element circuit board design.
Beginning with the letter R
Reflow soldering (reflow): through the various stages, including: preheating, stable / drying, reflow peak and cooling, the solder surface mount components into the process in order to achieve a permanent connection.
Repair (repair): Restores the function of defective assembly operations.
Repeatability (reproducibility): precise return characteristics of the target process capability. An evaluation processing equipment and continuity indicators.
Rework (rework): The incorrect assembly back to meet the specifications or contract required a repeat procedure.
Rheology (Rheology): description of the flow of a liquid, or a viscosity and surface tension properties, such as solder paste.
Beginning with the letter S
Saponifier (saponification agent): an aqueous solution of an organic or inorganic main ingredients and additives, such as may be used by dispersing cleaners, promote rosin and water soluble flux removal.
Schematic (schematic diagram): symbols used in circuit layout diagrams, including electrical connections, components and functions.
Semi-aqueous cleaning (not completely water cleaning): involves solvent cleaning, hot flush and drying cycle technology.
Shadowing (shadow): In the infrared reflow soldering, the elements of the body from certain areas of the energy barrier, causing the temperature sufficient to completely melt the solder paste phenomenon.
Silver chromate test (Silver Chromate test): A qualitative, halide ions in the presence of RMA flux inspection. (RMA reliability, maintainability and availability)
Slump (slump): Before printing template After curing, solder paste, glue and other materials diffusion.
Solder bump (solder ball): a spherical solder material bonded to the contact area of ​​passive or active elements, played the role of the circuit connected to the pad.
Solderability (weldability): In order to form a strong connection, conductor (pin pad or trace) melt wet (turned weldable) capability.
Soldermask (solder): printed circuit board processing technology, in addition to the connection point for all surfaces to be welded is covered by a plastic coating.
Solids (solid): flux formulations, the percentage by weight of rosin, (solid content)
Solidus (solidus): some of the elements of the solder alloy begins to melt (liquid) temperature.
Statistical process control (SPC Statistical Process Control): technical analysis with statistical process output its results to guide the action, adjust and / or maintain quality control.
Storage life (shelf life): glue storage and keeping the usefulness of time.
Subtractive process (negative process): by removing selected portions of the conductive metal foil or coating layer, to obtain a circuit wiring.
Surfactant (surfactant): added to water reduces the surface tension, improve wetting chemicals.
Syringe (syringe): opening drop out of the container through its narrow glue.
Beginning with the letter T
Tape-and-reel (tape and disk): SMD components used in packaging, in a continuous strip, the charged components within the pit, the pit covered by a plastic tape to roll onto the disc, for component placement machine.
Thermocouple (TC): The sensor consists of two different metal, when heated, produces a small DC voltage at a temperature measurement.
Type I, II, III assembly (the first, two, three assembly): one side or both sides of the surface mount components of the PCB (I); leaded components are mounted on the main surface, there are SMD components mounted on one side or both sides of hybrid technology (II); to passive SMD components are mounted on a second surface mixing technology, pin (vias) element mounted on the main surface is characterized by (III).
Tombstoning (element erected): A welding defects, the sheet member is pulled to the vertical position, the other end is not welding.
Beginning with the letter U
Ultra-fine-pitch (ultra-fine-pitch): Center pin-center distance and the conductor spacing of 0.010 "(0.25mm) or less.
Beginning with the letter V
Vapor degreaser (stray oil vapor): A cleaning system, the object hanging in the box, the heated solvent vapor condenses on the surface.
Void (void): Tin point inside a hole, in the recirculation gas release or sandwich formed before curing flux residues.
Beginning with the letter Y
Yield (yield): components and submit the ratio of the number of components produced at the end of the manufacturing process used.

TypeInfo: Industry News

Keywords for the information:LED Mounter  Mounter jargon  Automation Equipment Co.  Ltd. of Shenzhen City Autopass 

 

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